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Research Article

High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication

Mark Triplett1,2, Hideki Nishimura4, Matthew Ombaba1, V. J. Logeeswarren1, Matthew Yee1, Kazim G. Polat1, Jin Y. Oh1, Takashi Fuyuki4, François Léonard3, M. Saif Islam1( )
Center for Nano and Micro ManufacturingDepartment of Electrical and Computer EngineeringUniversity of CaliforniaDavisCA95616USA
Department of PhysicsUniversity of CaliforniaDavisCA95616USA
Sandia National LaboratoriesLivermoreCA94551USA
Microelectronic Device Science LaboratoryNara Institute of Science and TechnologyJapan
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Graphical Abstract

Abstract

Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.

Keywords

flexible electronicsnanowirestransfer printingprintable electronicsnanoscale devices

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Nano Research
Volume 7 Issue 7,
July 2014
Pages 998-1006
DOI: 10.1007/s12274-014-0462-7
Cite this article:
Triplett M, Nishimura H, Ombaba M, et al. High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication. Nano Research, 2014, 7(7): 998-1006. https://doi.org/10.1007/s12274-014-0462-7

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Received: 14 February 2014
Revised: 25 March 2014
Accepted: 27 March 2014
Published: 04 June 2014
© Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2014
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