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Research Article

High thermal conductivity of suspended few-layer hexagonal boron nitride sheets

Haiqing Zhou1,2, Jixin Zhu3,4, Zheng Liu4, Zheng Yan1, Xiujun Fan1,5, Jian Lin3,6, Gunuk Wang1, Qingyu Yan4( ), Ting Yu2( ), Pulickel M. Ajayan3,6( ), James M. Tour1,3,6( )
Department of ChemistryRice University, 6100 Main Street, HoustonTexas77005USA
Division of Physics and Applied PhysicsSchool of Physical and Mathematical Sciences, Nanyang Technological UniversityNanyang637371Singapore
Department of Materials Science and NanoEngineeringRice University, 6100 Main Street, HoustonTexas77005USA
School of Materials Science and EngineeringNanyang Technological University, Nanyang AvenueNanyang639798Singapore
College of Electronic Information and Control EngineeringBeijing University of TechnologyBeijing100124China
The Smalley Institute for Nanoscale Science and TechnologyRice University, 6100 Main Street, HoustonTexas77005USA
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Graphical Abstract

Abstract

The thermal conduction of suspended few-layer hexagonal boron nitride (h-BN) sheets was experimentally investigated using a noncontact micro-Raman spectroscopy method. The first-order temperature coefficients for monolayer (1L), bilayer (2L) and nine-layer (9L) h-BN sheets were measured to be -(3.41 ± 0.12) × 10-2, -(3.15 ± 0.14) × 10-2 and -(3.78 ± 0.16) × 10-2 cm-1·K-1, respectively. The room-temperature thermal conductivity of few-layer h-BN sheets was found to be in the range from 227 to 280 W·m-1·K-1, which is comparable to that of bulk h-BN, indicating their potential use as important components to solve heat dissipation problems in thermal management configurations.

Keywords

two-dimensionalhexagonal boron nitride (h-BN)thermal conductivityRaman spectroscopy

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Nano Research
Volume 7 Issue 8,
August 2014
Pages 1232-1240
DOI: 10.1007/s12274-014-0486-z
Cite this article:
Zhou H, Zhu J, Liu Z, et al. High thermal conductivity of suspended few-layer hexagonal boron nitride sheets. Nano Research, 2014, 7(8): 1232-1240. https://doi.org/10.1007/s12274-014-0486-z

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Received: 10 March 2014
Revised: 23 April 2014
Accepted: 24 April 2014
Published: 28 June 2014
© Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2014
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