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Research Article

Boring holes in Au nanoplates by active surface etching

Haiyang Hu1,3, Yuntao Wang1, Qian Wang3,4, Xudong Peng3,4, An Su3,4, Hong Wang2(), Hongyu Chen3,4()
Institute of Advanced Synthesis (IAS) and School of Chemistry and Molecular Engineering, Jiangsu National Synergetic Innovation Centre for Advanced Materials, Nanjing Tech University, Nanjing 211816, China
Department of Environmental Science and Engineering, University of Science and Technology of China, Hefei 230026, China
Department of Chemistry, School of Science and Key Laboratory for Quantum Materials of Zhejiang Province, Research Center for Industries of the Future, Westlake University, Hangzhou 310030, China
Institute of Natural Sciences, Westlake Institute for Advanced Study, Hangzhou 310024, China
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The boring etching mode creates holes in Au nanoplates, in contrast to the conventional etching mode that targets the corner sites and makes nanostructures rounder, and the previous sharpening etching mode targets the edges when using neutral 2-naphthalenethiol (NT) as the ligand. The charge repulsion among the ligand 2-mercapto-5-benzimidazolecarboxylic acid (MBIA) was found to be the critical factor responsible for the unique mode of etching.

Abstract

In contrast to the conventional etching that makes nanoparticles rounder and our previous sharpening etching mode that causes serrated edges, here, we developed a new boring etching mode that targets the faces of Au nanoplates to make holes. The critical factors are the pre-incubation step with the ligand 2-mercapto-5-benzimidazolecarboxylic acid (MBIA) and the subsequent removal of excess ligands in the solution. Thus, etching is focused onto the few sites with initial loss of ligands, which cannot be quickly replaced. The choice of ligand MBIA is also of importance, as it carries negative charge and repels each other. Its inability of forming a dense layer probably plays a critical role in the site-selectivity for faces, because ligands at the higher curvature edges and corners are expected to have less repulsion. The etching results from the comproportionation reaction between Au3+ and Au0 in the nanoplates, where Br− coordination to Au and the extra stabilization from cetyltrimethylammonium bromide (CTAB) are essential. We believe that the ability of boring holes is an important tool for future synthetic designs.

Keywords

Au nanoplatesactive surface etchingboring etching modecetyltrimethylammonium bromide (CTAB) passivationholes

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Nano Research
Volume 17 Issue 9,
September 2024
Pages 8610-8617
DOI: 10.1007/s12274-024-6830-z
Cite this article:
Hu H, Wang Y, Wang Q, et al. Boring holes in Au nanoplates by active surface etching. Nano Research, 2024, 17(9): 8610-8617. https://doi.org/10.1007/s12274-024-6830-z
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