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Research Article | Open Access

Y2O3 nanosheets as slurry abrasives for chemical-mechanical planarization of copper

Xingliang HE1, Yunyun CHEN1,2, Huijia ZHAO3, Haoming SUN3, Xinchun LU3, Hong LIANG1,2,*( )
Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123, USA
Materials Science and Engineering, Texas A&M University, College Station, TX 77843-3123, USA
Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China
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Abstract

Continued reduction in feature dimension in integrated circuits demands high degree of flatness after chemical mechanical polishing. Here we report using new yttrium oxide (Y2O3) nanosheets as slurry abrasives for chemical-mechanical planarization (CMP) of copper. Results showed that the global planarization was improved by 30% using a slurry containing Y2O3 nanosheets in comparison with a standard industrial slurry. During CMP, the two-dimensional square shaped Y2O3 nanosheet is believed to induce the low friction, the better rheological performance, and the laminar flow leading to the decrease in the within-wafer-non-uniformity, surface roughness, as well as dishing. The application of the two-dimensional nanosheets as abrasive in CMP would increase the manufacturing yield of integrated circuits.

Keywords

Y2O3 nanosheetschemical-mechanical planarization (CMP)nanoabrasivesslurry flowwafer-pad contact

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Friction
Volume 1 Issue 4,
December 2013
Pages 327-332
DOI: 10.1007/s40544-013-0017-z
Cite this article:
HE X, CHEN Y, ZHAO H, et al. Y2O3 nanosheets as slurry abrasives for chemical-mechanical planarization of copper. Friction, 2013, 1(4): 327-332. https://doi.org/10.1007/s40544-013-0017-z

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Received: 13 March 2013
Revised: 22 May 2013
Accepted: 30 May 2013
Published: 20 July 2013
© The author(s) 2013

This article is published with open access at Springerlink.com

Open Access: This article is distributed under the terms of the Creative Commons Attribution Noncommercial License which permits any noncommercial use, distribution, and reproduction in any medium, provided the original author(s) and source are credited.
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