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Research Article | Open Access

Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire

Baichun ZHANG, Hong LEI( ), Yi CHEN
Research Center of Nano-Science and Nano-Technology, Shanghai University, Shanghai 200444, China
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Abstract

The chemical mechanical polishing (CMP) process has become a widely accepted global planarization technology. The abrasive material is one of the key elements in CMP. In the presented paper, an Ag-doped colloidal SiO2 abrasive is synthesized by a seed-induced growth method. It is characterized by time-of-flight secondary ion mass spectroscopy and scanning electron microscopy to analyze the composition and morphology. The CMP performance of the Ag-doped colloidal silica abrasives on sapphire substrates is investigated. Experiment results show the material removal rate (MRR) of Ag-doped colloidal silica abrasives is obviously higher than that of pure colloidal silica abrasives under the same testing conditions. The surfaces that are polished by composite colloidal abrasives exhibit lower surface roughness (Ra) than those polished by pure colloidal silica abrasives. Furthermore, the acting mechanism of Ag-doped colloidal SiO2 composite abrasives in sapphire CMP is analyzed by X-ray photoelectron spectroscopy, and analytical results show that element Ag forms Ag2O which acts as a catalyst to promote the chemical effect in CMP and leads to the increasing of MRR.

Keywords

chemical mechanical polishingAg-doped colloidal silica abrasivesapphirematerial removal rate

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Friction
Volume 5 Issue 4,
December 2017
Pages 429-436
DOI: 10.1007/s40544-017-0156-8
Cite this article:
ZHANG B, LEI H, CHEN Y. Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire. Friction, 2017, 5(4): 429-436. https://doi.org/10.1007/s40544-017-0156-8

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Received: 02 November 2016
Revised: 18 January 2017
Accepted: 14 February 2017
Published: 16 June 2017
© The author(s) 2017

This article is published with open access at Springerlink.com

Open Access: The articles published in this journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http:// creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
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