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Research Article | Open Access

Study on the influence of standoff distance on substrate damage under an abrasive water jet process by molecular dynamics simulation

Ruling CHEN1,§( )Di ZHANG1,2,§Yihua WU2
 College of Mechanical Engineering, Donghua University, Shanghai 201620, China
 Nano-Science and Technology Research Center, Shanghai University, Shanghai 200444, China

§ These authors contributed equally to this paper

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Abstract

The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradually diverge. As a result, the solidified water film between the cluster and the substrate becomes “thicker” and “looser”. The “thicker” and “looser” water film will then consume more input energy to achieve complete solidification, resulting in the stress region and the high-pressure region of the silicon substrate under small standoff distances to be significantly larger than those under large standoff distances. Therefore, the degree of damage sustained by the substrate will first experience a small change and then decrease quickly as the standoff distance increases. In summary, the occurrence and maintenance of complete solidification of the confined water film between the cluster and the substrate plays a decisive role in the level of damage formation on the silicon substrate. These findings are helpful for exploring the mechanism of an abrasive water jet.

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Friction
Pages 195-207
Cite this article:
CHEN R, ZHANG D, WU Y. Study on the influence of standoff distance on substrate damage under an abrasive water jet process by molecular dynamics simulation. Friction, 2018, 6(2): 195-207. https://doi.org/10.1007/s40544-017-0168-4

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Received: 09 February 2017
Revised: 09 May 2017
Accepted: 22 May 2017
Published: 02 October 2017
© The author(s) 2017

This article is published with open access at Springerlink.com

Open Access: The articles published in this journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http:// creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

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