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Research Article | Open Access

Prediction of electrical contact endurance subject to micro-slip wear using friction energy dissipation approach

Xiangjun JIANG1,2,3( ), Fengqun PAN1, Guoqiang SHAO2, Jin HUANG1, Jun HONG2, Aicheng ZHOU4
Key Laboratory of Electronic Equipment Structural Design, Xidian University, Xi'an 710071, China
State Key Laboratory for Manufacturing System, Xi’an Jiaotong University, Xi'an 710049, China
State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China
Guilin University of Aerospace Technology, Guilin 541004, China
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Abstract

Fretting wear is a common cause of failure of an electrical contact (EC). In this study, we analyzed in detail the failure of EC induced especially by sliding using the representative electrical terminals. Furthermore, combining the friction energy dissipation theory, we proposed a prediction model to evaluate the electrical connector endurance (ECE) based on the contact stress and geometrical changes during the wear process obtained from a numerical model. The study helps establish that the friction energy dissipation theory is a powerful tool to analyze a contact failure due to wear. The proposed model proves to be effective in predicting the ECE for all considered cases such as micro-slip amplitude, contact force, overturning angle, superficial layer thickness, and friction/wear coefficients.

Keywords

electrical connector endurancefretting wearfriction energy dissipationfinite element analysis

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Friction
Volume 7 Issue 6,
December 2019
Pages 537-550
DOI: 10.1007/s40544-018-0230-x
Cite this article:
JIANG X, PAN F, SHAO G, et al. Prediction of electrical contact endurance subject to micro-slip wear using friction energy dissipation approach. Friction, 2019, 7(6): 537-550. https://doi.org/10.1007/s40544-018-0230-x

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Received: 12 December 2017
Revised: 05 February 2018
Accepted: 06 July 2018
Published: 06 November 2018
© The author(s) 2018

This article is published with open access at Springerlink.com

The articles published in this journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
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