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Full Length Article | Open Access

Vibration-assisted material damage mechanism: From indentation cracks to scratch cracks

Bingrui LVa,, Bin LINa, Tianyi SUIa,b( ), Chunyan LIUa, Jinshuo ZHANGa, Longfei WANGa, Xuhui CHENc, Jingguo ZHOUa
Key Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, Tianjin University, Tianjin 300072, China
Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, Tianjin University, Tianjin 300072, China
Science and Technology of Advanced Functional Composite Laboratory, Aerospace Research Institute of Materials and Processing Technology, Beijing 100076, China

Peer review under responsibility of Editorial Committee of CJA.

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Abstract

Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages. However, the damage and crack propagation mechanisms of materials in vibration-assisted grinding are not well understood. In order to elucidate the mechanism of abrasive scratching during vibration-assisted grinding, a kinematic model of vibration scratching was developed. The influence of process parameters on the evolution of vibration scratches to indentation or straight scratches is revealed by displacement metrics and velocity metrics. Indentation, scratch and vibration scratch experiments were performed on quartz glass, and the results showed that the vibration scratch cracks are a combination of indentation cracks and scratch cracks. Vibration scratch cracks change from indentation cracks to scratch cracks as the indenter moves from the entrance to the exit of the workpiece or as the vibration frequency changes from high to low. A vertical vibration scratch stress field model is established for the first time, which reveals that the maximum principal stress and tensile stress distribution is the fundamental cause for inducing the transformation of the vibration scratch cracking system. This model provides a theoretical basis for understanding of the mechanism of material damage and crack propagation during vibration-assisted grinding.

Keywords

Material removal mechanismIndentationVibration assisted grindingVibration scratchStress field modelCrack propagation mechanism

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Chinese Journal of Aeronautics
Volume 37 Issue 8,
August 2024
Pages 527-546
DOI: 10.1016/j.cja.2023.12.013
Cite this article:
LV B, LIN B, SUI T, et al. Vibration-assisted material damage mechanism: From indentation cracks to scratch cracks. Chinese Journal of Aeronautics, 2024, 37(8): 527-546. https://doi.org/10.1016/j.cja.2023.12.013

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Received: 11 September 2023
Revised: 26 September 2023
Accepted: 14 November 2023
Published: 14 December 2023
© 2023 Chinese Society of Aeronautics and Astronautics.

This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
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