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Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages. However, the damage and crack propagation mechanisms of materials in vibration-assisted grinding are not well understood. In order to elucidate the mechanism of abrasive scratching during vibration-assisted grinding, a kinematic model of vibration scratching was developed. The influence of process parameters on the evolution of vibration scratches to indentation or straight scratches is revealed by displacement metrics and velocity metrics. Indentation, scratch and vibration scratch experiments were performed on quartz glass, and the results showed that the vibration scratch cracks are a combination of indentation cracks and scratch cracks. Vibration scratch cracks change from indentation cracks to scratch cracks as the indenter moves from the entrance to the exit of the workpiece or as the vibration frequency changes from high to low. A vertical vibration scratch stress field model is established for the first time, which reveals that the maximum principal stress and tensile stress distribution is the fundamental cause for inducing the transformation of the vibration scratch cracking system. This model provides a theoretical basis for understanding of the mechanism of material damage and crack propagation during vibration-assisted grinding.
Tong J, Yang S, Ye Y, et al. Edge breakage mechanism of optical glass surface in ultrasonic vibration-assisted milling. Int J Adv Manuf Technol 2023;131:2265–78.
Zhao LJ, Cheng J, Chen MJ, et al. Formation mechanism of a smooth, defect-free surface of fused silica optics using rapid CO2 laser polishing. Int J Extrem Manuf 2019;1:035001.
Yu SM, Zhu JH, Yao P, et al. Profile error compensation in precision grinding of ellipsoid optical surface. Chin J Aeronaut 2021;34(4):115–23.
Qin B, Liu HN, Cheng J, et al. Hemispherical resonator with low subsurface damage machined by small ball-end fine diamond grinding wheel: a novel grinding technique. Chin J Aeronaut 2024;37(5):570–85.
Chen F, Li GX, Zhao B, et al. Thermomechanical coupling effect on characteristics of oxide film during ultrasonic vibration-assisted ELID grinding ZTA ceramics. Chin J Aeronaut 2021;34(6):125–40.
Wang JJ, Zhang JF, Feng PF, et al. Damage formation and suppression in rotary ultrasonic machining of hard and brittle materials: a critical review. Ceram Int 2018;44(2):1227–39.
Zhao FF, Lin B, He YP, et al. Interference mechanism and damage accumulation in high-speed cross scratches on hard brittle materials. Chin J Aeronaut 2022;35(3):579–91.
Huang H, Li XL, Mu DK, et al. Science and art of ductile grinding of brittle solids. Int J Mach Tool Manu 2021;161:103675.
Li C, Li XL, Wu YQ, et al. Deformation mechanism and force modelling of the grinding of YAG single crystals. Int J Mach Tool Manu 2019;143:23–37.
Huang C, Zhou M, Zhang HJ. Investigations on the micro-interactions of grit-workpiece and forces prediction in ultrasonic vibration side grinding of optical glass. J Mater Process Tech 2022;300:117415.
Wang YQ, Li XL, Wu YQ, et al. The removal mechanism and force modelling of gallium oxide single crystal in single grit grinding and nanoscratching. Int J Mech Sci 2021;204:1065562.
Li HN, Yu TB, Zhu LD, et al. Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon. Mater Des 2017;130:250–62.
Ma ZL, Wang QH, Chen H, et al. A grinding force predictive model and experimental validation for the laser-assisted grinding (LAG) process of zirconia ceramic. J Mater Process Tech 2022;302:117492.
Meng QY, Guo B, Wu GC, et al. Dynamic force modeling and mechanics analysis of precision grinding with microstructured wheels. J Mater Process Tech 2023;314:117900.
Meng QY, Guo B, Wu GC, et al. Accurate modeling and controlling of weak stiffness grinding system dynamics with microstructured tools. Mech Syst Signal Pr 2023;201:110659.
Meng QY, Guo B, Zhao QL, et al. Modelling of grinding mechanics: a review. Chin J Aeronaut 2023;36(7):25–39.
Zhang YB, Li WY, Tang LZ, et al. Abrasive water jet tool passivation: from mechanism to application. J Adv Manuf Sci Tech 2023;3(1):2022018.
Liu MZ, Li CH, Zhang YB, et al. Analysis of grinding mechanics and improved grinding force model based on randomized grain geometric characteristics. Chin J Aeronaut 2023;36(7):160–93.
Axinte D, Huang H, Yan JW, et al. What micro-mechanical testing can reveal about machining processes. Int J Mach Tool Manu 2022;183:103964.
Xiang JF, Xie LJ, Gao FN. Modeling high-speed cutting of SiCp/Al composites using a semi-phenomenologically based damage model. Chin J Aeronaut 2021;34(8):218–29.
Zhang YF, Zhu SL, Zhao YY, et al. A material point method based investigation on crack classification and transformation induced by grit geometry during scratching silicon carbide. Int J Mach Tool Manu 2022;177:103884.
Feng JY, Wan ZP, Wang W, et al. Unique crack behaviors of glass BK7 occurred in successive double scratch under critical load of median crack initiation. J Eur Ceram Soc 2020;40:3279–90.
Li C, Piao YC, Zhang FH, et al. Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF2 single crystals. Int J Extrem Manuf 2023;5(1):015101.
Huang SQ, Gao S, Huang CZ, et al. Nanoscale removal mechanisms in abrasive machining of brittle solids. Diamond Abrasives Eng 2022;42(3):257–67 [Chinese].
Xiao GJ, Zhang YD, Huang Y, et al. Grinding mechanism of titanium alloy: research status and prospect. J Adv Manuf Sci Tech 2021;1(1):2020001.
Li C, Zhang FH, Wang X, et al. Repeated nanoscratch and double nanoscratch tests of Lu2O3 transparent ceramics: material removal and deformation mechanism, and theoretical model of penetration depth. J Eur Ceram Soc 2018;38(2):705–18.
Luna GG, Axinte D, Novovic D. Influence of grit geometry and fibre orientation on the abrasive material removal mechanisms of SiC/SiC Ceramic Matrix Composites (CMCs). Int J Mach Tool Manu 2020;157:103580.
Liu Q, Liao ZR, Axinte D. Temperature effect on the material removal mechanism of soft-brittle crystals at nano/micron scale. Int J Mach Tool Manu 2020;159:103620.
Lv BR, Lin B, Sui TY, et al. Crack extension mechanism and scratch stress field model of hard and brittle materials caused by curvature effect. J Mater Process Tech 2023;319:118058.
An QL, Chen J, Ming WW, et al. Machining of SiC ceramic matrix composites: a review. Chin J Aeronaut 2021;34(4):540–67.
Liu Y, Li JH, Zhao ZG, et al. Advanced grinding technologies for silicon carbide ceramic: a review. J Adv Manuf Sci Tech 2024;4(1):2023016.
Feng PF, Liang GQ, Zhang JF. Ultrasonic vibration-assisted scratch characteristics of silicon carbide-reinforced aluminum matrix composites. Ceram Int 2014;40(7):10817–23.
Yang X, Gao S. Analysis of the crack propagation mechanism of multiple scratched glass-ceramics by an interference stress field prediction model and experiment. Ceram Int 2022;48(2):2449–58.
Wang PZ, Ge PQ, Bi WB, et al. Interaction of lateral cracks in double scratching of single-crystal silicon carbide. Theor Appl Fract Mec 2019;104:102378.
Jiang QQ, Zhang L, Yang CF. An analytical model for estimation of the stress field and cracks caused by scratching anisotropic single crystal gallium nitride. Mat Sci Semicon Proc 2021;122:105446.
Hill R. The mathematical theory of plasticity at the clarendon press. Math Gaz 1950;35(313):252–3.
Yoffe EH. Elastic stress fields caused by indenting brittle materials. Philos Mag A 1982;46(4):617–28.
Ahn Y, Farris TN, Chandrasekar S. Sliding microindentation fracture of brittle materials: role of elastic stress fields. Mech. Mater 1998;29(3–4):143–52.
Yang X, Qiu ZJ, Lu C, et al. Modelling the strain rate sensitivity on the subsurface damages of scratched glass ceramic. Ceram Int 2017;43(15):12930–21298.
Li XY, Gao YF, Ge PQ, et al. Nucleation location and propagation direction of radial and median cracks for brittle material in scratching. Ceram Int 2019;45(6):7524–36.
Wang H, Pei ZJ, Cong WL. A feeding-directional cutting force model for end surface grinding of CFRP composites using rotary ultrasonic machining with elliptical ultrasonic vibration. Int J Mach Tool Manu 2020;152:103540.
Wang H, Pei ZJ, Cong WL. A mechanistic cutting force model based on ductile and brittle fracture material removal modes for edge surface grinding of CFRP composites using rotary ultrasonic machining. Int J Mech Sci 2020;176:105551.
Li HB, Chen T, Duan ZY, et al. A grinding force model in two-dimensional ultrasonic-assisted grinding of silicon carbide. J Mater Process Tech 2022;304:117568.
Zheng ZD, Huang K, Lin CT, et al. An analytical force and energy model for ductile-brittle transition in ultra-precision grinding of brittle materials. Int J Mech Sci 2022;220:107107.
Lee SH. Analysis of ductile mode and brittle transition of AFM nanomachining of silicon. Int J Mach Tool Manu 2012;61:71–9.
Huang H, Lawn BR, Cook RF, et al. Critique of materials-based models of ductile machining in brittle solids. J Am Ceram Soc 2020;103(11):6096–100.
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