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Research Article | Open Access

Recent developments of stamped planar micro-supercapacitors: Materials, fabrication and perspectives

Fei Lia,c,d,1, Yang Lia,c,d,1, Jiang Qua,c,d, Jinhui Wanga,c,d, Vineeth Kumar Bandaria,c,d( ), Feng Zhub( ), Oliver G. Schmidta,c,d,e
Material Systems for Nanoelectronics, Chemnitz University of Technology, 09107, Chemnitz, Germany
State Key Laboratory of Polymer Physics and Chemistry, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, 130022, Changchun, China
Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
Institute for Integrative Nanosciences, Leibniz IFW Dresden, 01069, Dresden, Germany
School of Science, Dresden University of Technology, 01062, Dresden, Germany

1 Fei Li, Yang.

Show Author Information

Abstract

The rapid development of wearable and portable electronics has dramatically increased the application for miniaturized energy storage components. Stamping micro-supercapacitors (MSCs) with planar interdigital configurations are considered as a promising candidate to meet the requirements. In this review, recent progress of the different stamping materials and various stamping technologies are first discussed. The merits of each material, manufacturing process of each stamping method and the properties of stamping MSCs are scrutinized, respectively. Further insights on technical difficulties and scientific challenges are finally demonstrated, including the limited thickness of printed electrodes, poor overlay accuracy and printing resolution.

Keywords

MicrofabricationMicrosupercapacitorsStampingMiniaturized electronicsEnergy storage devices

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Nano Materials Science
Volume 3 Issue 2,
June 2021
Pages 154-169
DOI: 10.1016/j.nanoms.2020.10.003
Cite this article:
Li F, Li Y, Qu J, et al. Recent developments of stamped planar micro-supercapacitors: Materials, fabrication and perspectives. Nano Materials Science, 2021, 3(2): 154-169. https://doi.org/10.1016/j.nanoms.2020.10.003

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Received: 09 September 2020
Accepted: 03 October 2020
Published: 17 October 2020
© 2021 Chongqing University.
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