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Paper | Open Access

Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning

Yun Chen1,2Yanhui Chen1Junyu Long1Dachuang Shi1Xin Chen1( )Maoxiang Hou1Jian Gao1Huilong Liu1Yunbo He1,3Bi Fan4Ching-Ping Wong2,5( )Ni Zhao2( )
State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechnical Engineering, Guangdong University of Technology, Guangzhou 510006, People’s Republic of China
School of Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong
Guangdong ADA Intelligent Equipment Ltd, Foshan 510006, People’s Republic of China
Institute of Business Analysis and Supply Chain Management, College of Management, Shenzhen University, Shenzhen, People’s Republic of China
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States of America
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Abstract

Solid-state nanopores with controllable pore size and morphology have huge application potential. However, it has been very challenging to process sub-10 nm silicon nanopore arrays with high efficiency and high quality at low cost. In this study, a method combining metal-assisted chemical etching and machine learning is proposed to fabricate sub-10 nm nanopore arrays on silicon wafers with various dopant types and concentrations. Through a SVM algorithm, the relationship between the nanopore structures and the fabrication conditions, including the etching solution, etching time, dopant type, and concentration, was modeled and experimentally verified. Based on this, a processing parameter window for generating regular nanopore arrays on silicon wafers with variable doping types and concentrations was obtained. The proposed machine-learning-assisted etching method will provide a feasible and economical way to process high-quality silicon nanopores, nanostructures, and devices.

International Journal of Extreme Manufacturing
Pages 035104-035104
Cite this article:
Chen Y, Chen Y, Long J, et al. Achieving a sub-10 nm nanopore array in silicon by metal-assisted chemical etching and machine learning. International Journal of Extreme Manufacturing, 2021, 3(3): 035104. https://doi.org/10.1088/2631-7990/abff6a

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Received: 31 January 2021
Revised: 11 March 2021
Accepted: 10 May 2021
Published: 25 May 2021
© 2021 The Author(s).

Original content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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