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Topical Review | Open Access

Recent advances in meniscus-on-demand three-dimensional micro- and nano-printing for electronics and photonics

Shiqi HuXiao HuanYu LiuSixi CaoZhuoran WangJi Tae Kim ( )
Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong Special Administrative Region of China, People’s Republic of China
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Abstract

The continual demand for modern optoelectronics with a high integration degree and customized functions has increased requirements for nanofabrication methods with high resolution, freeform, and mask-free. Meniscus-on-demand three-dimensional (3D) printing is a high-resolution additive manufacturing technique that exploits the ink meniscus formed on a printer nozzle and is suitable for the fabrication of micro/nanoscale 3D architectures. This method can be used for solution-processed 3D patterning of materials at a resolution of up to 100 nm, which provides an excellent platform for fundamental scientific studies and various practical applications. This review presents recent advances in meniscus-on-demand 3D printing, together with historical perspectives and theoretical background on meniscus formation and stability. Moreover, this review highlights the capabilities of meniscus-on-demand 3D printing in terms of printable materials and potential areas of application, such as electronics and photonics.

International Journal of Extreme Manufacturing
Article number: 032009
Cite this article:
Hu S, Huan X, Liu Y, et al. Recent advances in meniscus-on-demand three-dimensional micro- and nano-printing for electronics and photonics. International Journal of Extreme Manufacturing, 2023, 5(3): 032009. https://doi.org/10.1088/2631-7990/acdf2d

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Received: 22 February 2023
Revised: 02 April 2023
Accepted: 15 June 2023
Published: 30 June 2023
© 2023 The Author(s).

Original content from this work may be used under the terms of the Creative Commons Attribution 4.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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