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Review | Open Access

Development of epoxy resin with superior breakdown strength: A Review

Li Shengtao( ), Li Mingru
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Shaanxi 710049, China
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Abstract

Epoxy resin (EP) has been widely utilized in electrical equipment and electronic devices due to its fascinating electric, thermal, and mechanical properties. However, the complex insulation structures of modern power devices in high-voltage direct current systems pose several challenges for EP-based dielectrics. The most significant among these challenges is the need for EP to stably operate under greater electric fields, requiring superior breakdown strength. This paper summarizes the key factors influencing the breakdown strength of EP and reviews reported methods for enhancing this property. Recognizing the limitations of existing approaches, we propose that the emerging technology of molecule design offers a potentially optimal solution for developing EP with enhanced breakdown strength. Furthermore, we anticipate the future development direction of EP with satisfactory insulation properties. We believe that enhancing the breakdown theory of solid dielectrics, exploring new research and development methodologies, and creating environmentally friendly EP with high performance are primary focus areas. We hope that this paper will offer guidance and support for the future development of EP with superior breakdown strength, proving valuable in advancing EP-based dielectrics.

Keywords

Epoxy resinbreakdown strengthelectrical insulation

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iEnergy
Volume 3 Issue 2,
June 2024
Pages 89-101
DOI: 10.23919/IEN.2024.0010
Cite this article:
Shengtao L, Mingru L. Development of epoxy resin with superior breakdown strength: A Review. iEnergy, 2024, 3(2): 89-101. https://doi.org/10.23919/IEN.2024.0010

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Received: 24 February 2024
Revised: 09 April 2024
Accepted: 19 April 2024
Published: 24 July 2024
© The author(s) 2024.

This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).
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