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Research Article | Open Access

Deciphering the leakage conduction mechanism of BiFeO3–BaTiO3 lead-free piezoelectric ceramics

Mengping XueaYucheng TangaZhihang ShanaYijin HaoaXiaoxiao ZhouaXiaoqi GaoaHezhang Lib( )Jun Peia( )Boping Zhanga( )
The Beijing Municipal Key Laboratory of New Energy Materials and Technologies, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
Department of Precision Instrument, Tsinghua University, Beijing 100084, China
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Graphical Abstract

Abstract

BiFeO3–BaTiO3 (BF–BT) based piezoelectric ceramics are a kind of high-temperature lead-free piezoelectric ceramics with great development prospects due to their high Curie temperature (TC) and excellent electrical properties. However, large leakage current limits their performance improvement and practical applications. In this work, direct current (DC) test, alternating current (AC) impedance, and Hall tests were used to investigate conduction mechanisms of 0.75BiFeO3–0.25BaTiO3 ceramics over a wide temperature range. In the range of room temperature (RT)−150 ℃, ohmic conduction plays a predominant effect, and the main carriers are p-type holes with the activation energy (Ea) of 0.51 eV. When T > 200 ℃, the Ea value calculated from the AC impedance and Hall data is 1.03 eV with oxygen vacancies as a cause of high conductivity. The diffusion behavior of thermally activated oxygen vacancies is affected by crystal symmetry, oxygen vacancy concentration, and distribution, dominating internal conduction mechanism. Deciphering the conduction mechanisms over the three temperature ranges would pave the way for further improving the insulation and electrical properties of BiFeO3–BaTiO3 ceramics.

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Journal of Advanced Ceramics
Pages 1844-1856
Cite this article:
Xue M, Tang Y, Shan Z, et al. Deciphering the leakage conduction mechanism of BiFeO3–BaTiO3 lead-free piezoelectric ceramics. Journal of Advanced Ceramics, 2023, 12(10): 1844-1856. https://doi.org/10.26599/JAC.2023.9220792

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Received: 04 May 2023
Revised: 06 July 2023
Accepted: 28 July 2023
Published: 08 October 2023
© The Author(s) 2023.

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