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Research Article | Open Access

Durable dual-state duplex Si–HfO2 with excellent oxidation and cracking resistance

Lin Chen1,Jing-Chuan Luo1,Wen-Qi Yang2Chang-Jiu Li1Guan-Jun Yang1( )
State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi’an Jiaotong University, Xi’an 710049, China
Xi’an Aerospace Engine Company Limited in CASC, Xi’an 710065, China

Lin Chen and Jing-Chuan Luo contributed equally to this work.

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Abstract

The lifetime of Si bond coatings in environmental barrier coatings is constrained by phase-transition-induced cracking of the SiO2 scale. In this study, Si–HfO2 dual-state duplex composite materials are proposed to address this issue by partially forming HfSiO4 and minimizing the SiO2 content. The as-prepared composite exhibited a structure comprising discrete HfO2 “bricks” embedded in a continuous Si “mortar”, while the oxidized state transformed into discrete HfSiO4 “bricks” within continuous thin SiO2 “mortars”. The results indicate that continuous thin SiO2 contributes to reducing the oxidation rate to a level comparable to that of pure Si, and discrete HfSiO4 particles aid in relieving phase transition-induced stress and inhibiting crack propagation, thereby enhancing oxidation and cracking resistance simultaneously. Consequently, the composite with 20 mol% HfO2 and a mean particle size of ~500 nm at 1370 ℃ exhibited a service lifetime 10 times greater than that of pure Si. This research provides valuable insights for designing Si-based bond coatings with improved service lifetime.

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Journal of Advanced Ceramics
Pages 388-401
Cite this article:
Chen L, Luo J-C, Yang W-Q, et al. Durable dual-state duplex Si–HfO2 with excellent oxidation and cracking resistance. Journal of Advanced Ceramics, 2024, 13(3): 388-401. https://doi.org/10.26599/JAC.2024.9220863

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Received: 07 December 2023
Revised: 23 January 2024
Accepted: 04 February 2024
Published: 29 March 2024
© The Author(s) 2024.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, http://creativecommons.org/licenses/by/4.0/).

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