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Research Article | Open Access | Just Accepted

Synergistic promotion of dielectric and thermomechanical properties of porous Si3N4 ceramics by a dual-solvent template method

Yuanyuan LiuZhilin Tian( )Liya ZhengBin Li( )

School of Materials, Shenzhen Campus of Sun Yat-sen University, Shenzhen 518107, China

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Abstract

Porous Si3N4 ceramic is a promising high-temperature wave transparent material used as a radome or antenna window of hypersonic aircraft. However, it still faces a challenging trade-off between dielectric and thermomechanical properties. Therefore, tailoring the microstructure and properties of porous Si3N4 is of great significance. In this work, porous Si3N4 ceramics with uniform and fine structures were achieved by the dual-solvent templating combined freeze-casting method. The as-prepared porous Si3N4 ceramic, with 56% porosity, possesses high mechanical properties with flexural strength and compressive strength of 95±14.8 MPa and 132±4.5 MPa, respectively. The uniform spherical pore structure improves the mechanical properties, and the rod-shaped Si3N4 grains facilitate crack deflection. The decreased pore size effectively blocks the phonon transport leading to a low thermal conductivity of only 4.2 W·K-1·m-1. Meanwhile, the porous Si3N4 ceramic maintains a small dielectric constant of 3.3 and the dielectric loss is stable between 1.0×10-3~4.0×10-3, which guarantees its potential application in high-temperature wave-transparent components. The results contribute a significant advancement in the development of high-performance wave-transparent materials used in hypersonic aircraft.

Journal of Advanced Ceramics
Cite this article:
Liu Y, Tian Z, Zheng L, et al. Synergistic promotion of dielectric and thermomechanical properties of porous Si3N4 ceramics by a dual-solvent template method. Journal of Advanced Ceramics, 2024, https://doi.org/10.26599/JAC.2024.9220962

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Received: 12 April 2024
Revised: 20 August 2024
Accepted: 26 August 2024
Available online: 26 August 2024

© The author(s) 2024

The articles published in this open access journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/).

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