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Research Article | Open Access | Just Accepted

Thermal cycle impact on polycrystalline silicon: Direct observation of electrical properties degradation and interfacial nanocrystalline grain defects

Qiaoqiao Kang1Xin Tian3Pu Wang2Haoxian Yan1Jifang Tao2Yi Yang1Tian-Ling Ren1()

1 School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing 100049, China

2 School of Information Science and Engineering, Shandong University, Qingdao 266237, China

3 Xinhua Semiconductor Technology Co., Ltd., Xuzhou 221000, China

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Abstract

Tracing interfacical nanocrystalline grain defects (NCGD) formation inducing electrical characteristic degradation in thermal remains a challenging issue for Polycrystalline silicon (poly-Si) stable and reliable application in engineering. Here, we present a microelectromechanical systems (MEMS) unit, which is composed of tunnel oxide passivating contact poly-Si tandem layer. It is a pioneering work to explore poly-Si NCGD performance in the thermal cycle, which includes three Case periods and lasts 2 years. We obtain the thermal expansion deformation of poly-Si and demonstrate it with the thermal cycle finite element model (TC-FEM). Then, we reveal the key factor to be carrier mobility decay, in which the nanocrystal finite element model (NC-FEM) predicts grain displacement (GD) increasing, otherwise electronic mobility data is measured and determined by the Hall method. Specifically, dislocation defection accumulation is induced by grain refinement (GR), grain size (GS), and grain boundary (GB) increasing. Moreover, multiple twinning phenomena is displayed with 3D structural reconstruction, which provides the basis for the formation of new grains and substantiates the GR phenomena. The periodic lattice strain induces deep trap accumulation and chemical degradation during operation, which restricts the carrier mobility. Ultimately, the electron-hole’s scattering probability is enhanced, promoting the decrease in resistivity. These findings differ from the conventional poly-Si electrical properties changing mechanisms, which enrich our understanding of NCGD in poly-Si materials. Additionally, we obtain insights into the resistance drift and carrier transport mechanisms and unravel the structural and mechanistic hierarchical twinning processes governed by defective. The findings of this work can have significant implications for the stability and reliability of poly-Si field-effect transistors or the pursuit of high-efficiency tandem solar cells.

Nano Research
Cite this article:
Kang Q, Tian X, Wang P, et al. Thermal cycle impact on polycrystalline silicon: Direct observation of electrical properties degradation and interfacial nanocrystalline grain defects. Nano Research, 2025, https://doi.org/10.26599/NR.2025.94907398
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