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Keyword: thermal interface materials (TIMs)
Research Article
Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packaging
Ruixiang Bai, Yangbing Wei, Jiyuan Xu, [...], Xiaobo Li, Menglin Li, Ziwen Zou, Xinyan Huang, Chengyu Liu, Yiwei Sun, Menglong Hao << Fewer
Published: 17 July 2023
2023, 16 (8): 11389-11400
Total 1