AI Chat Paper
Note: Please note that the following content is generated by AMiner AI. SciOpen does not take any responsibility related to this content.
{{lang === 'zh_CN' ? '文章概述' : 'Summary'}}
{{lang === 'en_US' ? '中' : 'Eng'}}
Chat more with AI
Powered by AMiner. Clicking this button will take you away from SciOpen.
Home Journal of Advanced Manufacturing Science and Technology Article
PDF (16.9 MB)
Cite
EndNote(RIS) BibTeX
Collect
Submit Manuscript AI Chat Paper
Show Outline
Outline
Show full outline
Hide outline
Outline
Show full outline
Hide outline
Open Access

Manufacturing microelectrode with automation control: A critical review

Ning WANGa, Wentao SUNa,b, Yonghao LIUa, Juanjuan LIc( ), Yongqiang ZHUa, Xiaowei WANGb, Guixue BIANd, Xiangyi LIUe, Lin WANG5, Dazhao YUe, Feng WANGf, Jiantao QIa( )
College of New Energy, China University of Petroleum (East China), Qingdao 266580, China
Aviation Industry Corporation of China, Ltd., Luoyang 471027, China
Henan Institute of Special Equipment Inspection Technology, Zhengzhou 450000, China
Naval Aeronautical University, Qingdao 266041,China
Naval University, Yantai 264001, China
Henan Research Institute of Boiler and Pressure Vessel Inspection Technology, Zhengzhou 450003, China

Peer review under responsibility of Editorial Committee of JAMST

Show Author Information

Abstract

Electroplating at the micro and nano scales is an electrochemical deposition technique, regarded as one additive manufacturing process, to achieve the preparation and surface modification of nano devices. The present review mainly discussed two key inflcuing factors including microelectrode probe manufacturing (the length of tapered needle tipe and diameter of microelectrode tip) and the distance automation control in the micro and nano dimension between microelectrode and substrate. In addition, the mechanism and application of electrochemical etching for different microelectrode tips and automation control systems are focused. Finally, the challenges and prospect in electroplating at micro and nano scales were discussed.

Keywords

Additive manufacturingElectrochemical depositionEtchingElectroplatingProbe tipDistance control

References

1

Jung W, Jung Y, Pikhitsa PV, et al. Three-dimensional nanoprinting via charged aerosol jets. Nature 2021;592(7852):54-59.
Crossref Google Scholar
2

Wang Y. Research on the application and development of 3D printing technology. Modern Manufacturing Technology and Equipment 2019;(04):138-139 [Chinese].
Google Scholar
3

Han G. The development status and prospects of 3D printing technolo‐ gy. Shandong Industrial Technology 2019;(04):48.
Google Scholar
4

Chen J. Analysis of the application and development trends of 3D printing technology. Digital Communication World 2018;(02):149+280.
Google Scholar
5
Guo JY. Research on local electrodeposition additive manufacturing of copper metal microstructures based on micro anode[dissertation]. Jilin University; 2022.
6

Lan HB, Li DC, Lu BH. Micro nano scale 3D printing. Chinese Science: Technical Science 2015;45(09):919-940 [Chinese].
Crossref Google Scholar
7
Zhao X. Process planning for thick-film mask projection micro stereolithography[dissertation]. Atlanta: Georgia Institute of Technology; 2009.
8

Wang S, Yu Y, Liu H. Sub-10-nm suspended nano-web formation by direct laser writing. Nano Futures 2018;2(2):025006 [Chinese].
Crossref Google Scholar
9

Sutanto E, Shigeta K, Kim Y K, et al. A multimaterial electrohydrodynamic jet (E-jet) printing system. Journal of Micromechanics and Microengineering 2012;22(4):045008.
Crossref Google Scholar
10

Pellicer E, Pané S, Panagiotopoulou V, et al. Localized electrochemical deposition of porous Cu-Ni microcolumns: Insights into the growth mechanisms and the mechanical performance. International Journal of Electrochemical Science 2012;7:4014-4029.
Crossref Google Scholar
11

Yan Y, Zhang W, Lu QP. The principle and development of RPM based on the concept of discrete/stacking forming. China Mechanical Engineering 1994;(04):64-66 [Chinese].
Google Scholar
12

Feng C. Research on rapid prototyping technology of metal materials based on mechanical manufacturing process. World Nonferrous Metals 2019;(23):56-57 [Chinese].
Google Scholar
13

Cao LX, Tu ZM, Li N, et al. Research progress in the preparation of single metal nanocrystalline materials by electrodeposition method. Material Protection 2009;42(06):47-52+87 [Chinese].
Google Scholar
14

Tu ZM, Hu HL, Yu YC, et al. Preparation method and mechanism of electrodeposited nanocrystalline materials. Electroplating and Environmental Protection 2006;(04):4-8 [Chinese].
Google Scholar
15

Kamaraj A, Lewis S, Sundaram M. Numerical study of localized electrochemical deposition for micro electrochemical additive manufacturing. Procedia Manufacturing 2016;42(05):788-792.
Crossref Google Scholar
16

Wei L, Lin X, Wang M, et al. Numerical simulation of metal laser additive manufacturing process. Aviation Manufacturing Technology 2017;(13):16-25 [Chinese].
Google Scholar
17

Braun TM, Schwartz DT. The emerging role of electrodeposition in additive manufacturing. Electrochemical Society Interface 2016; 25(1): 69-73.
Crossref Google Scholar
18

Wang Y, Yi F, Zhang T. Design and property study of micro-slot optics. Optics Communications 2017;386:14-21 [Chinese].
Crossref Google Scholar
19

Schurch P, Ramachandramoorthy R, Pethö L, et al. Additive manufacturing by template-assisted 3D electrodeposition: Nanocrystalline nickel microsprings and microspring arrays. Applied Materials Today 2019; 100:472.
Crossref Google Scholar
20

Marques C, Desta YM, Rogers J, et al. Fabrication of high-aspect-ratio microstructures on planar and nonplanar surfaces using a modified LIGA process. Journal of Microelectromechanical Systems 1997;6(4): 329-336.
Crossref Google Scholar
21

Wang WH, Holl MR, Schwartz DT. Rapid prototyping of masks for through-mask electrodeposition of thick metallic components. Electrochemical Society 2001;148(5):C363-C368 [Chinese].
Crossref Google Scholar
22

Asoh H, Uchibori K, Ono S. Anisotropic chemical etching of silicon through anodic oxide films formed on silicon coated with microspheres. Semiconductor Science & Technology 2011;26(10):102001.
Crossref Google Scholar
23

Garnett E, Yang P. Light trapping in silicon nanowire solar cells. Nano Letters 2010;10(3):1082-1087.
Crossref Google Scholar
24

Jiang P. Large-scale fabrication of periodic nanostructured materials by using hexagonal non-close-packed colloidal crystals as templates. Langmuir the Acs Journal of Surfaces & Colloids 2006; 22(9): 3955-3958.
Crossref Google Scholar
25

Hao Y, Zhu FQ, Chien CL, et al. Fabrication and magnetic properties of ordered macroporous nickel structures. Journal of the Electrochemical Society 2015;154(154):D65-D69.
Crossref Google Scholar
26

Spada ER, Rocha ASD, Jasinski EF, et al. Homogeneous growth of antidot structures electrodeposited on Si by nanosphere lithography. Journal of Applied Physics 2008;103(11):2199-2203.
Crossref Google Scholar
27

Ming PM, Li XC, Zhang XM, et al. Electrochemical 3D microdeposition technology and its research progress. Chinese Science: Technical Science 2018;48(04):347-359 [Chinese].
Crossref Google Scholar
28

Liu T, Jia WP, Wu MH, et al. Study on the forming process of maskless localized electrodeposited micro nickel columns. Electrical Machining and Molds 2022;(04):41-44+52 [Chinese].
Google Scholar
29

Jia WP, Wu MH, Jia ZY, et al. Research progress in maskless localized electrodeposition additive manufacturing technology. Rare Metal Material and Engineering 2019;48(02):693-700 [Chinese].
Google Scholar
30

Brant A, Sundaram M, Kamaraj AB. Finite element stimulation of socialized electrochemical deposition for maskless electrochemical additive manufacturing. Journal of Manufacturing Science and Engineering 2015;137(1):011018.
Crossref Google Scholar
31

Madden J, Hunter I. Three-dimensional microfabrication by localized electrochemical deposition. Journal of Microelectromechanical Systems 1996;5:24-32.
Crossref Google Scholar
32

Sundaram M, Kamaraj AB, Kumar VS. Maskless electrochemical additivemanufacturing: A feasibility study. Journal of Manufacturing Science and Engineering 2015;137(2):021006.
Crossref Google Scholar
33

Manukyan N, Kamaraj AB, Sundaram M. Localized electrochemical deposition using ultra-high frequency pulsed power. Procedia Manufacturing 2019;(34):197-204.
Crossref Google Scholar
34

Wang F, Xiao Y, Bian H, et al. Effect of aliphatic-amine ethoxy sulfonates (AESS) on micro copper columns fabrication by using localized electrochemical deposition. Materials Research Express 2019; 6(9): 0965b3.
Crossref Google Scholar
35

Wang CY, Lin JC, Chang YC, et al. Fabrication of Cu-Zn alloy micropillars by potentiostatic localized electrochemical deposition. Journal of The Electrochemical Society 2019;166:E252-E262.
Crossref Google Scholar
36

Pané S, Panagiotopoulou V, Fusco S, et al. The effect of saccharine on the localized electrochemical deposition of Cu-rich Cu-Ni microcolumns. Electrochemistry Communications 2011;13(9):973-976.
Crossref Google Scholar
37

Stupian GW, Leung MS. A scanning tunneling microscope based on a motorized micrometer. Review of entific Instruments 1989;60(2):181-185.
Crossref Google Scholar
38

Binnig G, Rohrer H, Gerber C, et al. Surface studies by scanning tunneling microscopy. Surface Studies by Scanning Tunneling Microscopy 1982;49(1):57-61.
Crossref Google Scholar
39

Yakobson BI, Moyer PJ, Paesler MA. Kinetic limits for sensing tip morphology in near-field scanning optical microscopes. Journal of Applied Physics 1993;73:79-84.
Crossref Google Scholar
40

Cavallini M, Biscarini F. Electrochemically etched nickel tips for spin polarized scanning tunneling microscopy. Review of Entific Instruments 2000;71(12):4457-4460.
Crossref Google Scholar
41

Bartolini L, Poletti A, Marks R, et al. Revised electrochemical etching system for a reproducible fabrication of ultra-sharp tungsten tips. Journal of Applied Electrochemistry 2021;51(3):551-566.
Crossref Google Scholar
42

Dong CY, Meng GD, Saji SE, et al. Simulation-guided nanofabrication of high-quality practical tungsten probes. Rsc Advances 2020;10(41): 24280-24287.
Crossref Google Scholar
43

Zhang JW, Wang PY, Zhang XA, et al. Systematic electrochemical etching of various metal tips for tunneling spectroscopy and scanning probe microscopy. Review of Scientific Instruments 2021; 92(1): 015124.
Crossref Google Scholar
44

Biegelsen DK, Ponce FA, Tramontana JC. Simple ion mining preparation of (111) tungsten tips. Applied Physics Letters 1989;54(13):1223-1225.
Crossref Google Scholar
45

Hermans A, Wightman RM. Conical tungsten tips as substrates for the preparation of ultramicroelectrodes. Langmuir 2006; 22(25): 10348-10353.
Crossref Google Scholar
46

Thompson JR, Danko JC, Gregory TL, et al. Suface characterization studies on CVD tungsten. Thermionic Power Operation 1969;30-31.
Google Scholar
47

Deng XJ. Observation of dislocations in tungsten materials using etching pit technique. Rare Metals 1984;(01):67-69 [Chinese].
Google Scholar
48

Khan Y, Al-Falih H, Zhang YP, et al. Two-step controllable electrochemical etching of tungsten scanning probe microscopy tips. Review of Scientific Instruments 2012;83(6):1-8.
Crossref Google Scholar
49

Ji H, Wang W. Study on electrochemical etching processing of tungsten cobalt hard alloy. Surface Technology 2002; 31(5): 32-35 [Chinese].
Google Scholar
50
Wang SZ. Biomechanical study on the construction of biomimetic surface of implants by electrolytic etching method[dissertation]. Jilin University 2010.
51

Buck WR, Leidheiser H. The corrosion of single crystals and recrystallized single crystals of iron and steel in citric acid. Journal of The Electrochemical Society 1957;104(8):474-481.
Crossref Google Scholar
52

Young FW. Etch pits at dislocations in copper. Journal of Applied Physics 1961;32(2):192-201.
Crossref Google Scholar
53

Hashimoto S, Miura S, Kubo T. Dislocation etch pits in gold. Journal of Materials Science 1976;11:1501-1508.
Crossref Google Scholar
54

Nanev CN, Dicheva K. Electrochemical etching. Electrochimica Acta 1983;28(7):933-940.
Crossref Google Scholar
55

Cai BC, Dasgupta A, Chou YT. Etch pits on single crystals and bicrystals of niobium. Journal of The Less Common Metals 1983;90:37-47.
Crossref Google Scholar
56

Feng D, Min NB, Li Q. Study on dislocation line etching images in molybdenum crystals. Acta Physica Sinica 1964;20(4):337-351 [Chinese].
Crossref Google Scholar
57

Feng D, Li Q, Min NB. Study on the structure of sub grain boundary dislocations in molybdenum single crystals. Acta Physica Sinica 1965; 21(2):431-449 [Chinese].
Crossref Google Scholar
58

Luo Y, Wang ZQ, Li WC. The formation conditions and geometric diversity of erosion pits. Acta Metallurgica Sinica 1982;18(4):472-484 [Chinese].
Google Scholar
59

Volovlikova O, Gavrilov S, Goroshko D, et al. Formation mechanisms and photoluminescence properties of self-organized porous Si/SiO2 structures formed by electrochemical etching of n-type of Si. Materials Science in Semiconductor Processing 2020;120:105268.
Crossref Google Scholar
60

Liu DL, Nie EY, Zhang YS, et al. Preparation of porous silicon by electrochemical anodization and its luminescent properties. Semiconductor Optoelectronics 2011;32(3):375-379 [Chinese].
Crossref Google Scholar
61

Wang FG, Cao ZY, Liang AM, et al. Preparation of inverted pyramids by electrochemical and chemical etching of n-type silicon under thermodynamic equilibrium state. ECS Journal of Solid State Science and Technology 2018;7(4):P192-P196.
Crossref Google Scholar
62

Xu JW, Liu S, Yang YP, et al. Preparation of porous silicon by electrochemical etching methods and its morphological and optical properties. International Journal of Electrochemical Science 2019;14:5188-5199.
Crossref Google Scholar
63

Zenia F, Lévy-Clément C, Triboulet R, et al. Surface texturisation of ZnTe crystals and thin films. Thin Solid Films 2000;361:49-52.
Crossref Google Scholar
64

Fuchsberger K, Binder K, Burkhardt C, et al. Electrochemical etching of micro-pores in medical grade cobalt-chromium alloy as reservoirs for drug eluting stents. Journal of Materials Science: Materials in Medicine 2016;27:47-55.
Crossref Google Scholar
65

Jang YS, Choi WT, Johnson CT, et al. Inhibition of bacterial adhesion on nanotextured stainless steel 316L by electrochemical etching. ACS Biomaterials Science & Engineering 2018;4:90-97.
Crossref Google Scholar
66

Ibe JP. On the electrochemical etching of tips for scanning tunneling microscopy. Journal of Vacuum Science & Technology A Vacuum Surfaces & Films 1990;8(4):3570-3575.
Crossref Google Scholar
67

Ju BF, Chen YL, Ge Y. The art of electrochemical etching for preparing tungsten probes with controllable tip profile and characteristic parameters. The Review of Entific instruments 2011;82(1):013707.
Crossref Google Scholar
68

Sun HJ, Qiu JH, Ji HL, et al. Study on the preparation of tungsten probes based on electrochemical corrosion method. Applied Chemistry 2015;44(04):761-763 [Chinese].
Google Scholar
69

Xu JT, Gao ST, Huang L, et al. Research on tungsten probe preparation device based on electrochemical corrosion method. Journal of Metrology 2018;39(03):294-298 [Chinese].
Google Scholar
70

Okamoto K, Yoshimoto k, Sugawara Y, et al. KPFM imaging of Si (111), 53×53 Sb surface for atom distinction using NC-AFM. Applied Surface Science 2003;210(1/2):128-133.
Crossref Google Scholar
71

Yang WY, Lin ZX, Fu H, et al. Study on surface potential of lithium iron phosphate based on kelvin probe technology. Inorganic Salt Industry 2022;54(11):65-70 [Chinese].
Google Scholar
72

Wang WW, Li C, Zeng GG, et al. Application of kelvin probe atomic force microscopy in the study of CdTe polycrystalline thin films. Experimental Science and Technology 2022;20(04):13-17 [Chinese].
Google Scholar
73

Bdikin I, Sharma DK, Otero-Lrurueta G, et al. Charge injection in large area multilayer graphene by ambient Kelvin probe force microscopy. Applied Materials Today 2017;8(21):18-25.
Crossref Google Scholar
74

Xie Y, Li SH, Zhang G, et al. A new type of inductive displacement sensor. Sensor 1999;(02):26-28 [Chinese].
Google Scholar
75

Liu Y, Wang Y. The current status and development trend of displacement sensor technology. Techniques of Automation and Applications 2013;32(06):76-80 [Chinese].
Google Scholar
76

Gai WQ. Exploration of micro displacement measurement technology. Heilongjiang Science 2018;9(09):162-164 [Chinese].
Google Scholar
77

Raamat R, Lohmus R, Lohmus A, et al. Piezoresonance driver for positioning scanning probe microscopes in a wide temperature range. Ferroelectrics 2001;258(1-4):47-52.
Crossref Google Scholar
78

Fujita T, Matsubara A, Kono D, et al. Dynamic characteristics and dual control of a ball screw drive with integrated piezoelectric actuator. Precision Engineering 2010;34(1):34-42.
Crossref Google Scholar
79

Elfizy AT, Bone GM, Elbestawi MA. Design and control of a dual-stage feed drive. International Journal of Machine Tools & Manufacture 2005;45(2):153-165.
Crossref Google Scholar
80

Chai JW, Gui XG. Overview of structural optimization and application of voice coil motors. Transaction of China Electrotechnical Society 2021;36(06):1113-1125.
Google Scholar
81

Kang D, Kim K, Kim D, et al. Optimal design of high precision xy-scanner with nanometer-level resolution and millimeter-level working range. Mechatronics 2009;19(4):562-570.
Crossref Google Scholar
82

Shewale M, Razban A, Deshmukh S, et al. Design, development and implementation of the position estimator algorithm for harmonic motion on the xy flexural mechanism for high precision positioning. Sensors 2020;20(3):662-682.
Crossref Google Scholar
83

Yoshioka H, Shinno H, Sawano H. A newly developed rotary-linear motion platform with a giant magnetostrictive actuator. CIRP Annals-Manufacturing Technology 2013;62(1):371-374.
Crossref Google Scholar
84

Qiu CL, Fan N, Zhan YM, et al. Development of shape memory alloy thermal engine driver. Mechanical Engineer 2018;(12):93-96 [Chinese].
Google Scholar
85

Li HL, Wang Y, Huang WQ, et al. A biped driven piezoelectric linear motor. China Mechanical Engineering 2014; 25(20): 2719-2723 [Chinese].
Google Scholar
86

Jywe W, Liu CH, Teng YF. Development of a flexure hinge-based stack-type five-degree-of-freedom nanometre-scale stage for a heavy-loading machining process. Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture 2007; 221(3):379-385.
Crossref Google Scholar
87

Liu CH, Jywe WY, Jeng YR, et al. Design and control of a long-traveling nano-positioning stage. Precision Engineering 2010;34(3):497-506.
Crossref Google Scholar
88
Zhang DX. Research on new methods of atomic force microscopy and development of a new atomic force microscope system[dissertation]. Zhejiang University; 2004.
89

Cao FH, Liu XY, Zhu ZJ, et al. Numerical simulation and distance control of scanning electrochemical microscope and its application. Journal of Chinese Society for Corrosion and Protection 2017;37(05):395-401 [Chinese].
Google Scholar
Journal of Advanced Manufacturing Science and Technology
Volume 4 Issue 3,
July 2024
Article number: 2024008
DOI: 10.51393/j.jamst.2024008
Cite this article:
WANG N, SUN W, LIU Y, et al. Manufacturing microelectrode with automation control: A critical review. Journal of Advanced Manufacturing Science and Technology, 2024, 4(3): 2024008. https://doi.org/10.51393/j.jamst.2024008

213

Views

3

Downloads

0

Crossref

0

Scopus

Altmetrics
Received: 11 January 2024
Revised: 16 January 2024
Accepted: 26 January 2024
Published: 15 July 2024
© 2024 JAMST

This is an Open Access article distributed under the terms of the Creative Commons Attribution License http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Return