Electroplating at the micro and nano scales is an electrochemical deposition technique, regarded as one additive manufacturing process, to achieve the preparation and surface modification of nano devices. The present review mainly discussed two key inflcuing factors including microelectrode probe manufacturing (the length of tapered needle tipe and diameter of microelectrode tip) and the distance automation control in the micro and nano dimension between microelectrode and substrate. In addition, the mechanism and application of electrochemical etching for different microelectrode tips and automation control systems are focused. Finally, the challenges and prospect in electroplating at micro and nano scales were discussed.