Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties, thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity. This greatly expands the applications of copper as a functional material in thermal and conductive components, including electronic packaging materials and heat sinks, brushes, integrated circuit lead frames. So far, endeavors have been focusing on how to choose suitable ceramic components and fully exert strengthening effect of ceramic particles in the copper matrix. This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles, including ceramic particle content, size, morphology and interfacial bonding, on the diathermancy, electrical conductivity and mechanical behavior of copper matrix composites. The corresponding models and influencing mechanisms are also elaborated in depth. This review contributes to a deep understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites. By more precise design and manipulation of composite microstructure, the comprehensive properties could be further improved to meet the growing demands of copper matrix composites in a wide range of application fields.